Front Elements
Keys
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32× software-assignable hybrid lever keys |
Rotaries
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2× rotary encoders for data entry |
Displays
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3× high-resolution, bright color, sunlight readable TFT displays with multi-touch control (capacitive) |
Mic
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1× threaded 6.3 mm jack for microphone 1× internal panel microphone |
Headset
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User-exchangeable Headset connector with preinstalled 4-pin male XLR connector. (Mono: XLR4M / Stereo: XLR7M) |
Speaker
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2× full-range, high-quality speakers |
USB
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1× USB 2.0 (standard Type-A, max. 500 mA) |
NFC
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Technology RFID, Frequency 13.56 MHz (future use) |
Bluetooth
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Frequency DTS Band 2400 ... 2483.5 MHz (future use) |
Light Sensor
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Adaptation of the display brightness to the environment (future use) |
Rear Elements
IEC
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Power Input |
SFP
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2× Ethernet ETH 3 / ETH 4 (Ethernet, AES67) |
USB
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1× USB 2.0 (standard Type-C, max. 500 mA) |
MicroSD-card
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1× MicroSD / MicroSDHC card up to 32 GB (for service purpose only) |
RJ45
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2× Ethernet ETH 1 / ETH 2 (10/100/1000BASE-T Ethernet, AES67) |
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1× Expansion EXP connector for expansion panels |
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1× Management MGNT connector for panel configuration
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1× Matrix connector for matrix connection (AES3) |
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2× Analog audio 4-wire inputs and outputs |
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2× Headset (“Headset A” is identical to front connector signal) |
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BNC
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1× Matrix connector for matrix connection (AES3) |
DisplayPort
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1× DisplayPort connector |
Sub-D9 (male)
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3× GPI output (max. 48 V / 300 mA, protected by self-healing fuse) |
Sub-D9 (female)
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3× GPI input (+5 V ... +48 V) |
Audio
Maximum Level
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Audio A/B Output |
+24 dBu |
@ 0 dBFS, 2 kΩ load |
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+23 dBu |
@ 0 dBFS, 600 Ω load |
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Audio A/B Input |
+24 dBu |
≙ 0 dBFS |
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Headset Phones |
+20.5 dBu |
@ 0 dBFS, 150 Ω load |
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Headset Microphone |
+6 dBu |
≙ -6 dBFS |
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Max SPL Internal Speaker |
110 dB |
@ 1 m |
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Frequency Response
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Panel/Internal Mic (electret) |
70 Hz ... 20 kHz, -3 dB
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@ 25 µA (≙ 110 dB SPL) |
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Headset Mic A/B |
20 Hz ... 20 kHz, -0.1 dB |
@ -20 dBFS (-20 dBu),
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Headset Phones |
20 Hz ... 20 kHz, -0.4 dB |
@ -20 dBFS, 150 Ω load |
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Audio A/B Input |
20 Hz ... 20 kHz, -0.4 dB |
@ -20 dBFS (+4 dBu),
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Audio A/B Output |
20 Hz ... 20 kHz, -0.3 dB |
@ -20 dBFS, 600 Ω load |
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Internal Speaker |
120 Hz ... 16.6 kHz, -10 dB |
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Distortion THD+N
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Panel Mic |
<0.03 %, 70 Hz ... 20 kHz |
@ 25 µA (≙ 110dB SPL) |
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Headset Mic A/B |
<0.004 %, 20 Hz ... 20 kHz |
@ -1 dBFS (-1 dBu),
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Headset Phones |
<0.10 %, 20 Hz ... 200 Hz
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@ -1 dBFS, 150 Ω load |
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<0.03 %, 20 Hz ... 200 Hz
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@ -20 dBFS, 150 Ω load |
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Audio A/B Input |
<0.010 %, 20 Hz ... 20 kHz |
@ -1 dBFS (+23 dBu),
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<0.004 %, 20 Hz ... 20 kHz |
@ -20 dBFS (+4 dBu),
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Audio A/B Output |
<0.004 %, 20 Hz ... 20 kHz |
@ -1 dBFS, 600 Ω load |
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Sample Rate / Resolution
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48 kHz / 24 Bit |
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General
Power
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Supply Voltage |
100 - 240 VAC, 50 - 60 Hz |
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Power Consumption |
≤20 W, ≤70 BTU/hr |
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Dimensions
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Width |
483 mm / 19" (445 mm / 17.5", installing dimensions) |
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Height |
88 mm / 3.5" |
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Depth |
138 mm / 5.4" (95 mm / 3.7", installing dimensions) |
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Form Factor |
19”, 2 RU |
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Weight
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3.4 kg / 7.4 lbs |
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Cooling
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Fan Noise
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<23 dB(A) idle,
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@ 0.7m (low noise emission
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Environment
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Operating Temperature |
0° … +45°C |
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Storage Temperature |
-30° … +80°C |
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Humidity |
20 % ... 90 % relative (non-condensing) |
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Max. Altitude |
3000 m AMSL |
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