Front Elements
Keys
|
16× software-assignable hybrid lever keys |
Rotaries
|
2× rotary encoders for data entry |
Displays
|
3× high-resolution, bright color, sunlight readable TFT displays with multi-touch control (capacitive) |
Mic
|
1× threaded 6.3 mm jack for microphone 1× internal panel microphone |
Headset
|
User-exchangeable Headset connector with preinstalled 4-pin male XLR connector. (Mono: XLR4M / Stereo: XLR7M) |
Speaker
|
1× full-range, high-quality speakers |
USB
|
1× USB 2.0 (standard Type-A, max. 500 mA) |
NFC
|
Technology RFID, Frequency 13.56 MHz (future use) |
Bluetooth
|
Frequency DTS Band 2400 ... 2483.5 MHz (future use) |
Light Sensor
|
Adaptation of the display brightness to the environment (future use) |
Rear Elements
IEC
|
Power Input |
SFP
|
2× Ethernet ETH 3 / ETH 4 (Ethernet, AES67) |
USB
|
1× USB 2.0 (standard Type-C, max. 500 mA) |
MicroSD-card
|
1× MicroSD / MicroSDHC card up to 32 GB (for service purpose only) |
RJ45
|
2× Ethernet ETH 1 / ETH 2 (10/100/1000BASE-T Ethernet, AES67) |
|
1× Expansion EXP connector for expansion panels |
|
|
1× Management MGNT connector for panel configuration
|
|
|
1× Matrix 1 connector for matrix connection (AES3) |
|
|
2× Analog audio 4-wire inputs and outputs |
|
|
2× Headset (“Headset A” is identical to front connector signal) |
|
BNC
|
1× Matrix 2 connector for matrix connection (AES3) |
DisplayPort
|
1× DisplayPort connector |
Sub-D9 (male)
|
3× GPI output (max. 48 V / 300 mA, protected by self-healing fuse) |
Sub-D9 (female)
|
3× GPI input (+5 V ... +48 V) |
Audio
Maximum Level
|
Audio A/B Output |
+24 dBu |
@ 0 dBFS, 2 kΩ load |
|
+23 dBu |
@ 0 dBFS, 600 Ω load |
||
|
Audio A/B Input |
+24 dBu |
≙ 0 dBFS |
|
|
Headset Phones |
+20.5 dBu |
@ 0 dBFS, 150 Ω load |
|
|
Headset Microphone |
+6 dBu |
≙ -6 dBFS |
|
|
Max SPL Internal Speaker |
101 dB |
@ 1 m |
|
Frequency Response
|
Panel/Internal Mic
|
70 Hz ... 20 kHz, -3 dB
|
@ 25 µA (≙ 110 dB SPL) |
|
Headset Mic A/B |
20 Hz ... 20 kHz, -0.1 dB |
@ -20 dBFS (-20 dBu),
|
|
|
Headset Phones |
20 Hz ... 20 kHz, -0.4 dB |
@ -20 dBFS, 150 Ω load |
|
|
Audio A/B Input |
20 Hz ... 20 kHz, -0.4 dB |
@ -20 dBFS (+4 dBu),
|
|
|
Audio A/B Output |
20 Hz ... 20 kHz, -0.3 dB |
@ -20 dBFS, 600 Ω load |
|
|
Internal Speaker |
140 Hz ... 16.6 kHz, -10 dB |
||
Distortion THD+N
|
Panel Mic |
<0.03 %, 70 Hz ... 20 kHz |
@ 25 µA (≙ 110dB SPL) |
|
Headset Mic A/B |
<0.004 %, 20 Hz ... 20 kHz |
@ -1 dBFS (-1 dBu),
|
|
|
Headset Phones |
<0.10 %, 20 Hz ... 200 Hz
|
@ -1 dBFS, 150 Ω load |
|
|
<0.03 %, 20 Hz ... 200 Hz
|
@ -20 dBFS, 150 Ω load |
||
|
Audio A/B Input |
<0.010 %, 20 Hz ... 20 kHz |
@ -1 dBFS (+23 dBu),
|
|
|
<0.004 %, 20 Hz ... 20 kHz |
@ -20 dBFS (+4 dBu),
|
||
|
Audio A/B Output |
<0.004 %, 20 Hz ... 20 kHz |
@ -1 dBFS, 600 Ω load |
|
Sample Rate / Resolution
|
48 kHz / 24 Bit |
||
General
Power
|
Supply Voltage |
100 - 240 VAC, 50 - 60 Hz |
|
|
Power Consumption |
≤15 W, ≤50 BTU/hr |
||
Dimensions
|
Width |
483 mm / 19" (445 mm / 17.5", installing dimensions) |
|
|
Height |
44 mm / 1.7" |
||
|
Depth |
138 mm / 5.4" (95 mm / 3.7", installing dimensions) |
||
|
Form Factor |
19”, 1RU |
||
Weight
|
2.3 kg / 5.1 lbs |
||
Cooling
|
Fan Noise
|
<23 dB(A) idle,
|
@ 0.7m (low noise emission
|
Environment
|
Operating Temperature |
0° … +45°C |
|
|
Storage Temperature |
-30° … +80°C |
||
|
Humidity |
20 % ... 90 % relative (non-condensing) |
||
|
Max. Altitude |
3000 m AMSL |
||